Wong Develops New Chemical Bath Technique that may Revolutionize 3D Packaging Costs
Recently, the laboratory team of Dr. C.P. Wong and Ph.D. candidate Liyi Li discovered a chemical process that may make 3D packaging development more productive with lower overall costs.
Using a technique the lab developed based on the fundamental physicochemical behavior of semiconductor materials in a simple chemical bath, the team was able to fabricate the high quality vias needed for component communication. The new electronics processing technique, named metal-assisted chemical etching, or MaCE, not only allowed for production at the necessary level of quality, but was also able to be scaled up to process multiple components in a singular batch. The new MaCE process is approximately 2 to 3 times less expensive than the traditional plasma etching technique and can increase manufacturing output by 1-2 orders of magnitude.